Clean manufacturing, reimagined

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Abstract

CO2 technology provides material and process engineers with a robust surface treatment platform and  window for a variety of complex substrates and microscopic geometries. Substrate and surface contamination such as particulate matter, outgassing residues, ionic residues, and heat can be addressed uniquely with this technology. Available treatment processes include composite jet spray, centrifugal immersion, supercritical fluid extraction, critical drying, and both vacuum and atmospheric plasma. CO2 technology eliminates or significantly reduces both lean and green waste generation at the production operation level (source) by modifying manufacturing processes such as precision cleaning and machining. Because CO2 is non-flammable, non-corrosive and dry, CO2 processes can integrate directly into manufacturing processes and tools to provide in-situ cleaning, thermal control or lubrication. CO2 technology can be implemented in a variety of process configurations to meet the constraints of lean production layouts and product flow requirements, including direct integration into existing production lines and equipment where the surface contamination is being generated. CO2 is a very unique manufacturing agent that affords multiple cost reduction and performance improvement opportunities in microelectronics device manufacturing operations.